Copper powder（FCu） is formed by cuprous ions of the copper plating liquid .It will lead to rough copper plating, debarring and copper off the formation of pinhole phenomenon. Copper plating is rough price of copper ions from it? Can be added to the bath 0.03 ~ 0.05ml / L of 30% hydrogen peroxide test after plating, if the price of copper ions is caused, over a period of time will copper, indicating a price of copper ions is very easy to produce. You should check the way the production of copper powder.

Copper production ways: First, check phosphor anode: (1) Check whether the surface of the anode phosphor black film, phosphor copper anode surface if no black film black film or less, indicating that phosphor copper anode with low phosphorus , can not control the production of monovalent copper ions, the formation of copper powder, copper plating caused rough. Need to replace phosphor copper anode. (2) Phosphor copper anode can not exceed the copper plating surface. Beyond the surface of the phosphor copper anode because there is no black film protection, when the phosphor copper anode titanium basket gradually decline, there is no black film to protect the phosphor copper anode into copper plating solution, and soon produce cuprous ions to form copper powder, resulting in rough copper plating; In addition, there is no black film to protect the phosphor copper anode surface is easy to cuprous sulfate crystals, quickly falling into the copper plating solution to produce a price of copper ions, the formation of copper powder, copper plating caused rough. Need to control the amount of phosphor copper anode added. (3) Plating bath on the board can not have a conductive copper rod or crystal adhesion, conductivity copper rod itself is a crystallization of Cu ions into the bath, will quickly produce a price of copper ions, the formation of copper powder, causing copper coating roughness.

Second, check the chloride ion content: (1) Low chloride ions, chloride ions can not be full price of copper ions with a combination of copper in the formation of divalent copper ions in the process can not be a full price of copper ions (chloride copper) into divalent copper ions (copper sulfate), the formation of bronze powder(FCu 663), plating caused by rough; Cl reduction is mainly from the large anode area and caused a small cathode area. That term in the large tank or bath plating excessive number of small sample size and small size board. Small cathode copper (II) ions required for less, while the anode is relatively more cuprous chloride deposited on the anode, or is likely to fall off and sedimentation caused by continuous filtration to remove chlorine ions in the bath reduced. (2) High when chloride ions, the formation of excess cuprous chloride, cuprous chloride ions such excess will produce disproportionate reaction, the formation of copper powder, copper plating caused rough. Increased levels of chloride ions mainly from clean water, add water. (3) The midpoint of the control of chloride ions 55ppm, the control range of 40 ~ 65ppm, when less than 35ppm, we should start adding chlorine ions; high 75ppm when the chloride ion, we should do to reduce chloride preparations. Source:http://www.mhcmp.com